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PESD5V0U1BA; PESD5V0U1BB; PESD5V0U1BL
Ultra low capacitance bidirectional ESD protection diodes
Rev. 01 -- 25 April 2007 Product data sheet
1. Product profile
1.1 General description
Ultra low capacitance bidirectional ElectroStatic Discharge (ESD) protection diodes in small Surface-Mounted Device (SMD) plastic packages designed to protect one data line from the damage caused by ESD.
Table 1. Product overview Package NXP PESD5V0U1BA PESD5V0U1BB PESD5V0U1BL SOD323 SOD523 SOD882 JEITA SC-76 SC-79 Package configuration very small flat lead ultra small leadless ultra small
Type number
1.2 Features
I Bidirectional ESD protection of one line I Ultra low leakage current: IRM = 5 nA I Ultra low diode capacitance: Cd = 2.9 pF I ESD protection of up to 10 kV I IEC 61000-4-2; level 4 (ESD)
1.3 Applications
I Computers and peripherals I Audio and video equipment I Cellular handsets and accessories I 10/100/1000 Ethernet I Local Area Network (LAN) equipment I Communication systems I Portable electronics I Subscriber Identity Module (SIM) card protection I FireWire I High-speed data lines
1.4 Quick reference data
Table 2. Quick reference data Tamb = 25 C unless otherwise specified. Symbol Per diode VRWM Cd reverse standoff voltage diode capacitance f = 1 MHz; VR = 0 V 2.9 5 3.5 V pF Parameter Conditions Min Typ Max Unit
NXP Semiconductors
PESD5V0U1BA/BB/BL
Ultra low capacitance bidirectional ESD protection diodes
2. Pinning information
Table 3. Pin 1 2 Pinning Description cathode 1 cathode 2
[1]
Simplified outline
Symbol
SOD323; SOD523
1
001aab540
2
1
sym045
2
SOD882 1 2 cathode 1 cathode 2
[1]
1
2
1
sym045
2
Transparent top view
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 4. Ordering information Package Name PESD5V0U1BA PESD5V0U1BB PESD5V0U1BL SC-76 SC-79 Description plastic surface-mounted package; 2 leads plastic surface-mounted package; 2 leads leadless ultra small plastic package; 2 terminals; body 1.0 x 0.6 x 0.5 mm Version SOD323 SOD523 SOD882 Type number
4. Marking
Table 5. Marking codes Marking code AA B3 AN Type number PESD5V0U1BA PESD5V0U1BB PESD5V0U1BL
PESD5V0U1BA_BB_BL_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 25 April 2007
2 of 12
NXP Semiconductors
PESD5V0U1BA/BB/BL
Ultra low capacitance bidirectional ESD protection diodes
5. Limiting values
Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per device Tj Tamb Tstg Table 7. Symbol Per diode VESD electrostatic discharge voltage IEC 61000-4-2 (contact discharge) MIL-STD-883 (human body model)
[1] [2] Device stressed with ten non-repetitive ESD pulses. Measured from pin 1 to pin 2.
[1][2]
Parameter junction temperature ambient temperature storage temperature ESD maximum ratings Parameter
Conditions
Min -65 -65
Max 150 +150 +150
Unit C C C
Conditions
Min -
Max 10 8
Unit kV kV
Table 8. Standard Per diode
ESD standards compliance Conditions > 15 kV (air); > 8 kV (contact) > 4 kV
IEC 61000-4-2; level 4 (ESD) MIL-STD-883; class 3 (human body model)
001aaa631
IPP 100 % 90 %
10 % tr = 0.7 ns to 1 ns 30 ns 60 ns t
Fig 1. ESD pulse waveform according to IEC 61000-4-2
PESD5V0U1BA_BB_BL_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 25 April 2007
3 of 12
NXP Semiconductors
PESD5V0U1BA/BB/BL
Ultra low capacitance bidirectional ESD protection diodes
6. Characteristics
Table 9. Characteristics Tamb = 25 C unless otherwise specified. Symbol Per diode VRWM IRM VBR Cd reverse standoff voltage reverse leakage current breakdown voltage diode capacitance VRWM = 5 V IR = 5 mA f = 1 MHz VR = 0 V VR = 5 V rdif differential resistance IR = 1 mA 2.9 1.9 3.5 100 pF pF 5.5 5 7 5 100 9.5 V nA V Parameter Conditions Min Typ Max Unit
3.0 Cd (pF) 2.6
006aab036
IPP
-VCL -VBR -VRWM
IR IRM -IRM -IR VRWM VBR VCL
2.2 -
+
1.8 0 1 2 3 4 VR (V) 5
-IPP
006aaa676
f = 1 MHz; Tamb = 25 C
Fig 2. Diode capacitance as a function of reverse voltage; typical values
Fig 3. V-I characteristics for a bidirectional ESD protection diode
PESD5V0U1BA_BB_BL_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 25 April 2007
4 of 12
NXP Semiconductors
PESD5V0U1BA/BB/BL
Ultra low capacitance bidirectional ESD protection diodes
ESD TESTER
RZ 450 RG 223/U 50 coax
4 GHz DIGITAL OSCILLOSCOPE 10x ATTENUATOR
50
CZ
IEC 61000-4-2 network CZ = 150 pF; RZ = 330
DUT (DEVICE UNDER TEST)
vertical scale = 10 A/div horizontal scale = 15 ns/div
vertical scale = 10 V/div horizontal scale = 100 ns/div
GND
GND
unclamped +8 kV ESD pulse waveform (IEC 61000-4-2 network)
clamped +8 kV ESD pulse waveform (IEC 61000-4-2 network) pin 1 to 2
vertical scale = 10 A/div horizontal scale = 15 ns/div GND GND
vertical scale = 10 V/div horizontal scale = 100 ns/div
unclamped -8 kV ESD pulse waveform (IEC 61000-4-2 network) clamped -8 kV ESD pulse waveform (IEC 61000-4-2 network) pin 1 to 2
006aab037
Fig 4. ESD clamping test setup and waveforms
PESD5V0U1BA_BB_BL_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 25 April 2007
5 of 12
NXP Semiconductors
PESD5V0U1BA/BB/BL
Ultra low capacitance bidirectional ESD protection diodes
7. Application information
The PESD5V0U1Bx series is designed for the bidirectional protection of one signal line from the damage caused by ESD pulses. The PESD5V0U1Bx series may be used on lines where the signal polarities are either positive or negative with respect to ground.
signal line
PESD5V0U1Bx
GND
006aab038
Fig 5. Bidirectional protection of one line
Circuit board layout and protection device placement Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge transients. The following guidelines are recommended: 1. Place the PESD5V0U1Bx as close to the input terminal or connector as possible. 2. The path length between the PESD5V0U1Bx and the protected line should be minimized. 3. Keep parallel signal paths to a minimum. 4. Avoid running protected conductors in parallel with unprotected conductors. 5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops. 6. Minimize the length of the transient return path to ground. 7. Avoid using shared transient return paths to a common ground point. 8. Ground planes should be used whenever possible. For multilayer PCBs, use ground vias.
PESD5V0U1BA_BB_BL_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 25 April 2007
6 of 12
NXP Semiconductors
PESD5V0U1BA/BB/BL
Ultra low capacitance bidirectional ESD protection diodes
8. Package outline
1.35 1.15 1 0.45 0.15 1.1 0.8 0.85 0.75 1 0.65 0.58
2.7 2.3
1.8 1.6
1.65 1.25 1.55 1.15
2 0.40 0.25 Dimensions in mm 0.25 0.10 03-12-17 Dimensions in mm 0.34 0.26
2 0.17 0.11 02-12-13
Fig 6. Package outline SOD323 (SC-76)
Fig 7. Package outline SOD523 (SC-79)
0.62 0.55 2
0.50 0.46
0.30 0.22
0.65 0.30 0.22 0.55 0.47 Dimensions in mm
1.02 0.95
1
cathode marking on top side 03-04-17
Fig 8. Package outline SOD882
PESD5V0U1BA_BB_BL_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 25 April 2007
7 of 12
NXP Semiconductors
PESD5V0U1BA/BB/BL
Ultra low capacitance bidirectional ESD protection diodes
9. Packing information
Table 10. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PESD5V0U1BA PESD5V0U1BB PESD5V0U1BL
[1]
Package SOD323 SOD523 SOD882
Description 4 mm pitch, 8 mm tape and reel 2 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 2 mm pitch, 8 mm tape and reel
Packing quantity 3000 -115 -115 8000 -315 10000 -135 -135 -315
For further information and the availability of packing methods, see Section 13.
10. Soldering
3.05 2.80 2.10 1.60
solder lands solder resist
1.65
0.95
0.50
0.60 occupied area solder paste
0.50 (2x)
msa433
Dimensions in mm
Fig 9. Reflow soldering footprint SOD323 (SC-76)
5.00 4.40 1.40 solder lands solder resist occupied area 2.75 1.20
msa415
preferred transport direction during soldering
Dimensions in mm
Fig 10. Wave soldering footprint SOD323 (SC-76)
PESD5V0U1BA_BB_BL_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 25 April 2007
8 of 12
NXP Semiconductors
PESD5V0U1BA/BB/BL
Ultra low capacitance bidirectional ESD protection diodes
2.15
1.20
0.50 0.60
solder lands solder paste solder resist occupied area
1.80 1.90 0.30 0.40
mgs343
Reflow soldering is the only recommended soldering method. Dimensions in mm
Fig 11. Reflow soldering footprint SOD523 (SC-79)
1.30 R = 0.05 (8x) 0.30 R = 0.05 (8x)
0.90
0.60 0.70 0.80 (2x) (2x) (2x)
solder lands solder paste solder resist occupied area
0.30 (2x) 0.40 (2x) 0.50 (2x)
mbl872
Reflow soldering is the only recommended soldering method. Dimensions in mm
Fig 12. Reflow soldering footprint SOD882
PESD5V0U1BA_BB_BL_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 25 April 2007
9 of 12
NXP Semiconductors
PESD5V0U1BA/BB/BL
Ultra low capacitance bidirectional ESD protection diodes
11. Revision history
Table 11. Revision history Release date 20070425 Data sheet status Product data sheet Change notice Supersedes Document ID PESD5V0U1BA_BB_BL_1
PESD5V0U1BA_BB_BL_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 25 April 2007
10 of 12
NXP Semiconductors
PESD5V0U1BA/BB/BL
Ultra low capacitance bidirectional ESD protection diodes
12. Legal information
12.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
12.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
13. Contact information
For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
PESD5V0U1BA_BB_BL_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 25 April 2007
11 of 12
NXP Semiconductors
PESD5V0U1BA/BB/BL
Ultra low capacitance bidirectional ESD protection diodes
14. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 Packing information. . . . . . . . . . . . . . . . . . . . . . 8 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 25 April 2007 Document identifier: PESD5V0U1BA_BB_BL_1

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